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韩国先进技术研究院K.W. Paik教授学术讲座通知
2017-07-11 10:00     (点击: )

主讲人:K.W. Paik

题目:NCFs (Non Conductive Films) Interconnection in 3D-TSV


时间:2017-7-12, 14:30






As demands for smaller and faster electronic products increased rapidly, 3D-packaging became inevitable in electro-packaging industry. Among various 3D packaging methods, 3D chip-stacking using through silicon via (TSV) technology becomes one of the best candidates to further reduce the size and improve electrical performance. Due to tremendous effort of many research organizations and industries, state-of-art TSV forming and copper via filling can be successfully developed. As TSV vertical interconnection methods, Cu pillar/Sn–Ag bump structure is being widely investigated for 3D TSV chip stacking. Recently, 40 μm pitch TSV-chip stacking is being applied in real products in IBM, however, there are two major problems in Cu pillar/ Sn–Ag bonding. The first problem is the voids formation within underfill materials and flux residue due to the limitation of capillary flow at the narrow gap of 3D-TSV stacked chips. The second problem is the faster-growth of Cu–Sn IMCs due to reduced size of Cu/Sn–Ag bumps and limited amount of Sn. These two problems can cause serious reliability problems. Therefore, the new idea of non-conductive film (NCF) with nano-particles was suggested as a potential solution for solving both problems.Wafer-level applied NCF is one of the most promising candidates to replace conventional underfill process due to its voidless under fill ability and easy processing, and it is being studied in many research organization.



Kyung W. Paik,韩国科学技术院(KAIST)教授,1979年获韩国首尔大学冶金工程专业学士学位,1981年硕士毕业于韩国科学技术院,1989年博士毕业于美国康奈尔大学材料科学与工程专业。1982年至1985年,作为研究人员就职于韩国科学技术院,负责金键合引线和有色合金等多种材料的开发工作。1989年博士毕业后加入通用电气公司的研发部门,并一直工作到1995年,期间作为高级技术人员参与到用于通用高密度互联(HDI)多芯片组块技术的材料和工艺的研发工作。此后,在1995年他加入KAIST,任材料科学与工程系教授,并在1999年和2005年分别在美国乔治亚理工大学封装研究中心和波特兰州立大学做访问教授。2011年至2013年,任材料科学与工程系研究副主席。Paik教授同时是IEEE-CPMTIMAPSSEMI等国际组织的会员,ECTCIMPACTEMAPEPTC等国际电子封装会议的组织者、技术委员、分委会主席和特邀报告人。他组建的纳米封装和互连实验室目前主要的研究领域包括各向异性导电粘合剂(ACAs)材料与工艺、三维硅通孔(3-D TSV)互连材料、钎料以及微机电系统(MEMS&显示封装技术。至今,Paik教授已经发表了150余篇SCI期刊论文,拥有40项授权和正在申请中的美国专利。